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Boîtier 14 broches dual in line
Boîtier double-ligne
Boîtier dual-in-line
Boîtier à double rangée de connexions

Translation of "Boîtier 14 broches dual in line " (French → English) :

TERMINOLOGY
see also In-Context Translations below
boîtier 14 broches dual in line
http://iate.europa.eu/FindTerm (...) (...) [HTML] [2017-12-31]
fourteen-pin DIL package
IATE - Information technology and data processing | Electronics and electrical engineering
IATE - Information technology and data processing | Electronics and electrical engineering
http://iate.europa.eu/FindTerm (...) (...) [HTML] [2017-12-31]
http://iate.europa.eu/FindTerm (...) [HTML] [2017-12-31]
boîtier à double rangée de connexions | boîtier double-ligne | boîtier dual-in-line
http://iate.europa.eu/FindTerm (...) (...) [HTML] [2017-12-31]
dual-in-line package | DIL [Abbr.] | DIP [Abbr.]
IATE - Information technology and data processing | Electronics and electrical engineering
IATE - Information technology and data processing | Electronics and electrical engineering
http://iate.europa.eu/FindTerm (...) (...) [HTML] [2017-12-31]
http://iate.europa.eu/FindTerm (...) [HTML] [2017-12-31]
IN-CONTEXT TRANSLATIONS
14. Le plomb dans les soudures comportant plus de deux éléments pour la connexion entre les broches et le boîtier de microprocesseurs, à teneur en plomb comprise entre 80 et 85 % en poids.
https://eur-lex.europa.eu/lega (...) (...) [HTML] [2011-06-07]
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
https://eur-lex.europa.eu/lega (...) (...) [HTML] [2011-06-07]
https://eur-lex.europa.eu/lega (...) [HTML] [2011-06-07]
14. Le plomb dans les soudures comportant plus de deux éléments pour la connexion entre les broches et le boîtier de microprocesseurs, à teneur en plomb comprise entre 80 et 85 % en poids.
http://eur-lex.europa.eu/legal (...) (...) [HTML] [2007-12-12]
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
http://eur-lex.europa.eu/legal (...) (...) [HTML] [2007-12-12]
http://eur-lex.europa.eu/legal (...) [HTML] [2007-12-12]


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Boîtier 14 broches dual in line

Date index:2022-12-24 -

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