– Nano-electronics, photonics and integrated micro/nano-systems: process, device and design technologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness for components, systems-on-a-chip, systems-in-a-package and integrated systems; basic photonic components for wide range of applications; high-performance/high-density data storage systems; very large area/highly integrated display solutions; sensing, actuating, vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organis ...[+++]ms; (self-)assembly of molecules or atoms into stable structures.

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for wide range of applications including ultra fast components; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous tec ...[+++]hnologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.

– Nano-electronics, photonics and integrated micro/nano-systems: process, device and design technologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness for components, systems-on-a-chip, systems-in-a-package and integrated systems; basic photonic components for wide range of applications; high-performance/high-density data storage systems; very large area/highly integrated display solutions; sensing, actuating, vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organis ...[+++]ms; (self-)assembly of molecules or atoms into stable structures.

"battery pack" means any set of batteries or accumulators that are connected together and/or encapsulated within an outer casing so as to form a complete unit that the end-user is not intended to split up or open;

In the last year, five new manufacturing facilities have been built across Canada two building towers, another building blades, and then nacelle assemblies and nacelle shells.

'The combined nomenclature, as contained in Annex I to Commission Regulation (EC) No 1734/96 of 9 September 1996 amending Annex I to Council Regulation (EEC) No 2658/87 on the tariff and statistical nomenclature and on the Common Customs Tariff, must be interpreted as meaning that a product consisting of a rectangular container with a lid of coated die-cast aluminium (aluminium/silicon alloy with aluminium content predominant by weight), four steel connecting bolts and four earthing bolts of copper-plated steel (packed loose in the product and yet to be inserted into threaded holes provided for that purpose), which is intended to receive ...[+++] electrical terminals and holes enabling electrical circuits to be connected, must be classified, in accordance with Rule 2(a) of the General Rules for the interpretation of the combined nomenclature, under subheading 8536 90 85 as an incomplete junction box'.